KY-8030
3D In-Line Solder Paste Inspection System
The new KY8030-2 and KY8030-3 deliver 3x faster inspection without compromising performance and accuracy.
Using patented dual projection, these systems eliminate the critical Shadow problem that all 3D SPI systems can be vulnerable to.
Additionally, the new KY8030-2 and KY8030-3 have solved the PCB warp problem that seriously impacts inspection accuracy and reliability of results.